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Product Details:
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| Types Of Ceramic: | Aluminum Nitride AlN | Flatness Of Chip Mounting Area: | ≤ 2 Um |
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| Roughness Of Chip Mounting Area: | ≤ 0.3 Um | Plating Thickness: | Ni (2-5um) |
| Water Flow: | ≥ 300ml/min | ||
| Highlight: | SMD Hybrid Integrated Circuit Package,Gold Plating Ceramic Integrated Package,JOPTEC Integrated Circuit Package |
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Technical characteristics:
Micro channel heat sink
Flatness of chip mounting area ≤ 2 um
Roughness of chip mounting area ≤ 0.3 um
Plating thickness: Ni (2-5um)
Au (0.05-0.15um)
Water flow ≥ 300ml/min
High thermal conductivity aluminum nitride ceramic heat sink
Types of Ceramic: Aluminum Nitride AlN
Thermal conductivity: 200 W/m.K
Roughness of metallized area: Ra 0.5um Max
Flatness of metallized area: 5um Max
Copper thickness accuracy: 75±10 um
Preset gold tin solder: Au (75±5wt%) Sn
Contact Person: JACK HAN
Tel: 86-18655618388
