Product Details:
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Bottom: | CS1010 | Lead: | Oxgyen Free Copper |
---|---|---|---|
Lead 2: | Copper Cored Alloy | Insulator: | Al2O3 |
Plating Coating: | Shell And Lead Plating Ni 3-11.43um | Leak Rate: | <=1*10-3 Pa*cm3/s |
Insulation Resistance: | 500V DC | ||
High Light: | CRS1010 housing Integrated Circuit Package,parallel sealing cap GJB548 hermetic package,Ceramic Al2O3 Integrated Circuit Package |
Product name: | High quality Customized Ceramic To Metal Sealing Package | |
Product formation | Material | Quantity |
bottom | CS1010 | 1 |
lead1 | oxgyen free copper | 4 |
lead 2 | copper cored alloy | 8 |
insulator | Al2O3 | 12 |
Plating coating: | Coating: shell and lead plating Ni:3-11.43um, lead plating Au>=1.3um. | |
Hermeticity: | Leak rate <=1*10-3 Pa*cm3/s. | |
Insulation resistance: | 500V DC, Insulation resistance between a single glass closure lead and the shell≥1*1010Ω | |
Product features: | 1.Housing material adopts CRS1010 which has good heat dissipation. | |
2.The pin material adopts Cupper cored alloy which has low resistance that can load high voltage. | ||
3.The method of sealing cap is parallel sealing welding. | ||
4.The pin cross bottom or sidewall which can be designed according to customers' needs. | ||
5.The position of ground lead can be designed according to customers' needs. | ||
6.The design of lid fits the dimension of package. | ||
7.Customers could choose fully plating or selective plating. | ||
8.All index of parameter conform to requirement of GJB548 |
Contact Person: JACK HAN
Tel: 86-18655618388