Product Details:
|
Product: | Micro Channel Heat Sink | Size: | 27.00 X 10.80 X 1.50 Mm |
---|---|---|---|
Flatness Of Chip Mounting Area: | ≤ 2 Um | Roughness Of Chip Mounting Area: | ≤ 0.3 Um |
Plating Thickness: | Au (0.05-0.15um) | Water Flow: | ≥ 300ml/min |
High Light: | Laser Hermetic heatsink,ceramic laser diode hermetic package |
Technical characteristics:
Product: Micro channel heat sink
Size: 27.00 x 10.80 x 1.50 mm
Flatness of chip mounting area: ≤ 2 um
Roughness of chip mounting area: ≤ 0.3 um
Plating thickness: Ni (2-5um)
Au (0.05-0.15um)
Water flow: ≥ 300ml/min
High thermal conductivity aluminum nitride ceramic heat sink
Type of ceramic: Aluminum Nitride AlN
Thermal conductivity: 200 W/m.K
Roughness of metallized area: Ra 0.5um Max
Flatness of metallized area: 5um Max
Copper thickness accuracy: 75±10 um
Preset gold tin solder: Au (75±5wt%) Sn
Contact Person: JACK HAN
Tel: 86-18655618388