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Product Details:
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| Welding Ring: | HLAgCu28 | Cap: | 10#Steel |
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| Lead: | 4J29(Kovar) | Glass Insulator: | BH-G/K |
| Bottom Floor: | 4J29(Kovar) | Hermeticity: | ≤1*10-3Pa.cm3/s |
| Shell: | FeNiCo,FeNi42 Or CRS | ||
| Highlight: | TO8 Encapsulated Transistor Outline Package,TO8 Enclosure Transistor Outline header,TO8 Transistor Outline Metal Package |
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| Product name: | Sealed enclosure alloy package for circuit | |
| Finish: | Fully plating Au or selective plating Au. | |
| Plating coating: | Plate and lead plating Ni:4-11.43um,plating Au:1.0-1.3um. Cap plating Ni:4-11.43um. | |
| Product formation: | Material | Quantity |
| 1. Cap | 10#Steel | 1 |
| 2. Welding ring | HLAgCu28 | 1 |
| 3. Lead 1 | 4J29(Kovar) | 1 |
| 4. Glass insulator | BH-G/K | 3 |
| 5. Lead 2 | 4J29(Kovar) | 3 |
| 6. Bottom floor | 4J29(Kovar) | 1 |
| Insulation resistance | 500V DC resistance between single glass sealed pin and shell is ≥1*1010Ω | |
| Hermeticity | Leak rate is ≤1*10-3Pa.cm3/s | |
| Product features: | 1. Shell adopt material:FeNiCo,FeNi42 or CRS; | |
| 2. The shape of pin is cyclinder and straight,material adopts Kovar. | ||
| 3. The sealing cap method is percussion welding or tin welding. | ||
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4. The rank of pin which cross the bottom of base could be choosen by customers. |
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| 5. The position of ground pin can be choosen by customer. | ||
| 6. The design of caps need to fit the shell. | ||
| 7. Customer could choose shell fully plating or pin selective plating. | ||
Contact Person: JACK HAN
Tel: 86-18655618388
