Product Details:
|
Name: | Hermetically Sealed Electronic Packages | Cover Plate: | 4J42 |
---|---|---|---|
Weld Piece: | HLAgCu28 | Finish: | Fully Plating Au(or Choose Selective Plating). |
Inner Cover Plate: | 2A12 | Glass Insulator: | BH-G/K |
Cavity: | 4J29(Kovar) | ||
High Light: | Rf Aluminum Hermetically Electronic Packages,RF Microwave Sealed Electronic Packages,Aluminum Alloy Electronic Components Enclosures Cavity |
Product name: | Electronic Components Enclosures Cavity Rf Microwave Package | |
Finish: | Fully plating Au(or choose selective plating). | |
Plating coating: |
The package, lead and cover are plated Ni: 1.3-11.43um, 1,and the package and lead are plated Au≥1.3um. Cover is plated Au:0.6-2.0um.2the package and pins are plated Au≥1.3um |
|
Product formation: | Material | Quantity |
Cover plate | 4J42 | 1 |
Inner cover plate | 2A12 | 1 |
Weld piece 1 | HLAgCu28 | 1 |
Septum 1 | 4J29(Kovar) | 1 |
Weld piece 2 | HLAgCu28 | 1 |
Septum 2 | 4J29(Kovar) | 1 |
Welding ring | HLAgCu28 | 4 |
Radiofrequency insulators | / | 4 |
Lead 1 | 4J29(Kovar) | 2 |
Glass insulator | BH-G/K | 5 |
Lead 2 | 4J29(Kovar) | 3 |
Cavity | 4J29(Kovar) | 1 |
Product features: |
1.Shell material adopts Kovar.To strengthen thermal conductivity the structure usually adopt separate bodies formed by brzaing.The materials of base are commonly Wcu and OFC. |
|
2.The sealing cap method use realiable paralllel sealing welding. | ||
3.Pins cross sidewall and its ranking and length depends on customers'needs. | ||
4.The location of ground lead is made by customer also. | ||
5.The lid is designed to fit the dimension of shell. | ||
6.The package needs to be electroplated to achieve high reliable performance. Customer could choose fully plating Au or selective plating Au. |
||
7.The frequency of radio-frequency head should be 20GHz,the standing wave ratio needs to be≤1.3. |
||
8.The other index of package should conform to requirement of GJB548. |
Contact Person: JACK HAN
Tel: 86-18655618388