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Product Details:
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| Application Fields: | DC Power Supply | Lead Welding Method: | Gold Wire Bonding |
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| Nickel Layer Thickness: | >3μm | Gold Layer Thickness: | > 0.45μm |
| Hermeticity: | Leak Rate ≤1x10-3Pa.cm3/s (He) | Insulation Resistance: | ≥1000MΩ (DC500V |
| Base: | Kovar Alloy | ||
| Highlight: | DM308 hermetic package,DC TR Integrated hermetic package,modulator Subassembly hermetic package |
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Main performance parameters
Application fields: DCDC power supply, filter, modulator
Lead welding method: tin welding, gold wire bonding
Nickel layer thickness: >3μm
Gold layer thickness:> 0.45μm
Hermeticity: leak rate ≤1x10-3Pa.cm3/s (He)
Insulation resistance: ≥1000MΩ (DC500V)
material:
Base: Kovar alloy, iron-nickel alloy, copper
Ring frame: Kovar alloy, steel
Lead: Kovar alloy, iron-nickel alloy, copper core composite
Cover plate: Kovar alloy, iron-nickel alloy, steel
Insulator: DM308 or similar, iron sealed glass beads, ceramic
Sealing process and technology: parallel seam welding, laser welding, tin sealing welding, stored energy welding
Contact Person: JACK HAN
Tel: 86-18655618388
