Product Details:
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Application Field: | Pump Laser Package | Lead Welding Method: | Tin Welding, Gold Wire Bonding |
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Nickel Layer Thickness: | >3μm | Gold Layer Thickness: | >0.45μm |
Hermeticity: | Leak Rate ≤1x10-3Pa.cm3/s (He) | Insulation Resistance: | ≥1000MΩ (DC500V) |
Pin Current: | 16A(φ1.5mm), 10A(φ1mm) | Insulator: | DM308 Or Similar, Iron Sealed Glass Beads, Ceramic |
Highlight: | Pump Laser hermetic package,JOPTEC Pump Laser hermetic seal,Optoelectronics Hermetic Laser Package |
Main performance parameters
Application field: pump laser package
Lead welding method: tin welding, gold wire bonding
Nickel layer thickness: >3μm
Gold layer thickness: >0.45μm
Hermeticity: leak rate ≤1x10-3Pa.cm3/s (He)
Insulation resistance: ≥1000MΩ (DC500V)
Pin current: 16A(φ1.5mm), 10A(φ1mm)
Material:
Base: copper
Ring frame: Kovar alloy, steel, copper
Lead: Kovar alloy, iron-nickel alloy, copper core composite
Cover: Kovar alloy, iron-nickel alloy
Insulator: DM308 or similar, iron sealed glass beads, ceramic
Sealing process and technology: parallel seam welding, laser welding
Contact Person: JACK HAN
Tel: 86-18655618388