Product Details:
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Application Fields: | ICR Package | Lead Welding Method: | Tin Welding, Gold Wire Bonding |
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Nickel Plating Thickness: | >3μm | Gold Plating Thickness: | >0.45μm |
Hermeticity: | Leak Rate ≤1x10-3Pa.cm3/s (He) | Shell: | Kovar Alloy, Copper, Aluminum, Steel, Etc. |
Lead: | Kovar Alloy, Iron-nickel Alloy, Copper Core Composite | Insulator: | DM308 Or Similar, Iron-sealed Glass Beads |
High Light: | 0.45μm Gold plating Hermetic Package,ICR hermetically sealed packaging,optimal function Hermetic electronic packages |
Main performance parameters
Application fields: ICR package
Lead welding method: tin welding, gold wire bonding
Nickel plating thickness: >3μm
Gold plating thickness: >0.45μm
Hermeticity: Leak rate ≤1x10-3Pa.cm3/s (He)
Material:
Shell: Kovar Alloy, copper, aluminum, steel, etc.
Lead: Kovar alloy, iron-nickel alloy, copper core composite
Cover plate: Kovar alloy, iron-nickel alloy, steel
Insulator: DM308 or similar, iron-sealed glass beads
Sealing process and technology: parallel seam welding, laser welding
Contact Person: JACK HAN
Tel: 86-18655618388