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Product Details:
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Application Fields: | Optical Communication Module | Lead Welding Method: | Tin Welding |
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Nickel Layer Thickness: | >3μm | Gold Layer Thickness: | > 0.45μm |
Insulation Resistance: | ≥1000MΩ (DC500V) | Base: | Kovar Alloy, Iron-nickel Alloy, Copper |
Ring Frame: | Kovar Alloy, Steel | Lead: | Kovar Alloy, Iron-nickel Alloy, Copper Core Composite |
High Light: | Single Function Module HERMETIC Packages,Optical Communication Module hermetic seal,Kovar Alloy laser Packages |
Main performance parameters
Contact Person: JACK HAN
Tel: 86-18655618388