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Ceramic To Metal Customized Hermetically Sealed Electronic Packages

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China JOPTEC LASER CO., LTD certification
China JOPTEC LASER CO., LTD certification
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When we purchased from JOPTEC for the first time, we realize it's a company that keeps their promises. Because of the high quality and reliability of these metal package we are well satisfied. JOPTEC's customer service team is always our friends in need. So we start a long term and strong partnership.

—— Andrew Garza

I wanna take the chance to thank the team of JOPTEC Laser, with their high quality products and after-sale service support. We believe that with our continuous efforts, we can win more customer credits and of course, a higher market share

—— Linda Kenny

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Ceramic To Metal Customized Hermetically Sealed Electronic Packages

Ceramic To Metal Customized  Hermetically Sealed Electronic Packages
Ceramic To Metal Customized  Hermetically Sealed Electronic Packages Ceramic To Metal Customized  Hermetically Sealed Electronic Packages Ceramic To Metal Customized  Hermetically Sealed Electronic Packages

Large Image :  Ceramic To Metal Customized Hermetically Sealed Electronic Packages

Product Details:
Place of Origin: HEFEI, CHINA
Brand Name: JOPTEC
Payment & Shipping Terms:
Minimum Order Quantity: 50 PCS
Packaging Details: Boxes
Delivery Time: 30 Days
Payment Terms: T/T
Supply Ability: 5000000 PCS/Month

Ceramic To Metal Customized Hermetically Sealed Electronic Packages

Description
Bottom: CS1010 Lead1: Oxgyen Free Copper
Lead: Copper Cored Alloy Insulator: Al2O3
Hermeticity: Leak Rate <=1*10-3 Pa*cm3/s. Insulation Resistance: 500V DC
Housing Material: CRS1010
Highlight:

Lead Pitch hermetic ceramic metal seals

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Lead Pitch Ceramic Terminal hermetic packages

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Al2O3 insulator hermetic package

Product name: Customized Ceramic To Metal Sealing Package With Lead Pitch And Ceramic Terminals
Product formation Material Quantity
bottom CS1010 1
lead1 oxgyen free copper 4
lead 2 copper cored alloy 8
insulator Al2O3 12
Plating coating: Coating: shell and lead plating Ni:3-11.43um, lead plating Au>=1.3um.
Hermeticity: Leak rate <=1*10-3 Pa*cm3/s.
Insulation resistance: 500V DC, Insulation resistance between a single glass closure lead and the shell≥1*1010Ω
Product features: 1. Housing material adopts CRS1010 which has good heat dissipation.
  2. The pin material adopts Cupper cored alloy which has low resistance that can load high voltage.
  3. The method of sealing cap is parallel sealing welding.
  4. The pin cross bottom or sidewall which can be designed according to customers' needs.
  5. The position of ground lead can be designed according to customers' needs.
  6. The design of lid fits the dimension of package.
  7. Customers could choose fully plating or selective plating.
  8. All index of parameter conform to requirement of GJB548

Contact Details
JOPTEC LASER CO., LTD

Contact Person: JACK HAN

Tel: 86-18655618388

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