|Base Material:||Low Carbon Steel, Kovar Ceramic, Tungsten Copper||Lead Material:||Kovar, Kovar Copper, Copper Alloy|
|Thermal Conductivity Of Base Plate:||＞150W/m.K||Air Tightness:||≤1x10-3Pa.cm3/s (He)|
|Plating:||Ni/Au||Reliability:||Meets MIL-883 Requirements|
Glass Automobiles SMD Outline Package,
joptec SMD Transistor Outline Package,
JEDE SMD Outline Package
Product name: TO and SMD type packages for transistor device
Applications: automatic control of machinery and electrical appliances in the fields of home appliances, automobiles, ships, motor cars, power electronics, etc.
Product characteristics: The external dimensions meet the JEDE standard, and the glass or ceramic air-tight connection is used. It is suitable for insertion and surface mounting. Parallel seam welding or energy storage welding can be used for cover (cap) sealing , the surface is nickel-plated and gold-plated, differential plating areas, differential gold and nickel plating thickness, good heat dissipation, good hermeticity and high reliability.
Base material: Low carbon steel, Kovar ceramic, tungsten copper, etc.
Lead material: Kovar, Kovar copper, copper alloy, etc.
Thermal conductivity of base plate: ＞150W/m.K
Air tightness: ≤1x10-3Pa.cm3/s (He)
Reliability: Meets MIL-883 requirements
Contact Person: JACK HAN