Applications:laser marking, laser cutting, laser welding, medical cosmetology and other fields
COS mounting surface height difference accuracy:±0.01mm
Flatness:≤0.05mm
Finish:Fully plating Au or selective plating Au
Plating:Package is plated Ni:3~11.43um and Au ≥0.8um Pins are plated Au ≥1.3um ;Lid is plated Au ≥0.8um
Cover plate:4J42(42alloy)
Product:Micro channel heat sink
Size:27.00 x 10.80 x 1.50 mm
Flatness of chip mounting area:≤ 2 um
Applications:laser marking, laser cutting, laser welding, medical cosmetology and other fields
COS mounting surface height difference accuracy:±0.01mm
Flatness:≤0.05mm
Application field:pump laser package
Lead welding method:tin welding, gold wire bonding
Nickel layer thickness:>3μm
Application field:Pump laser package
Lead welding method:tin welding, gold wire bonding
Nickel layer thickness:>3μm
Application field:Pump laser package
Lead welding method:tin welding, gold wire bonding
Nickel layer thickness:>3μm