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Product Details:
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| Eyelet: | W80Cu20 | Frame: | 4J29 |
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| Brazing Frame: | HLAgCu28 | Pin: | 4J29 |
| Glass Insulator: | Bh-a/k | ||
| Highlight: | 8pin High Hermiticity Butterfly Package,Pump Laser Diode hermetic package,DBR laser module hermetic seal |
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| Product name | High Quality Kovar Alloy Package Gold Plating Butterfly Package | |
| Finish | Fully plating Au or selective plating Au | |
| Plating coating | Shell and leads are plated Ni:1.3~11.43um and the whole header is plated Au≥0.75um | |
| Product formation | Material | Quantity |
| 1. eyelet | W80Cu20 | 1 |
| 2. frame | 4J29 | 1 |
| 3. brazing frame | HLAgCu28 | 1 |
| 4. pin | 4J29 | 8 |
| 5. glass insulator | bh-a/k | 8 |
| 6. tube | 4J29 | 1 |
| 7. brazing ring | HLAgCu28 | 1 |
| Insulation resistance | 500V DC resistance between single glass sealed pin and shell is ≥1*1010Ω | |
| Hermeticity | Leak rate is ≤1*10-3Pa.cm3/s | |
| Product features | 1. Material:housing kovar ring;kovar lead; base Wcu ; ceramic insulator; | |
| 2. Finish:fully plating Au; | ||
| 3. Insulation resistance:500V DC,resistance between signle lead and housing≥1*1010Ω; | ||
| 4. Hermeticity:leak rate≤1*10-3Pa.cm3/s. | ||
| 5. The point of measurement for thickness should be upper surface of brazing frame. | ||
| 6. Unless otherwise special noted:torlerance:.x=0.25;.xx=0.13;.xxx=0.05;angle is +/-5° | ||
Contact Person: Mr. JACK HAN
Tel: 86-18655618388
