|Name:||Hermetically Sealed Electronic Packages||Cover Plate:||4J42|
|Weld Piece:||HLAgCu28||Finish:||Fully Plating Au(or Choose Selective Plating).|
|Inner Cover Plate:||2A12||Glass Insulator:||BH-G/K|
Rf Aluminum Hermetically Electronic Packages,
RF Microwave Sealed Electronic Packages,
Aluminum Alloy Electronic Components Enclosures Cavity
|Product name:||Electronic Components Enclosures Cavity Rf Microwave Package|
|Finish:||Fully plating Au(or choose selective plating).|
The package, lead and cover are plated Ni: 1.3-11.43um, 1,and the
package and lead are plated Au≥1.3um. Cover is plated Au:0.6-2.0um.2the package and pins are plated Au≥1.3um
|Inner cover plate||2A12||1|
|Weld piece 1||HLAgCu28||1|
|Weld piece 2||HLAgCu28||1|
1.Shell material adopts Kovar.To strengthen thermal conductivity the structure
usually adopt separate bodies formed by brzaing.The materials of base are
commonly Wcu and OFC.
|2.The sealing cap method use realiable paralllel sealing welding.|
|3.Pins cross sidewall and its ranking and length depends on customers'needs.|
|4.The location of ground lead is made by customer also.|
|5.The lid is designed to fit the dimension of shell.|
6.The package needs to be electroplated to achieve high reliable performance.
Customer could choose fully plating Au or selective plating Au.
7.The frequency of radio-frequency head should be 20GHz,the standing wave
ratio needs to be≤1.3.
|8.The other index of package should conform to requirement of GJB548.|
Contact Person: JACK HAN